Micro-soldering method is the most efficient procedure to connect two ultra-fine wires for the production of micro-coils. The diameter of the ultra-fine wire can be up to as small as 59 AWG or 9 microns.
Clearly, this diameter is five to ten times smaller in comparison to the diameter of human hair. Therefore, when it comes to developing a connection between two ultra-fine wires, manufacturers face certain challenges due to the miniaturized size of the wires.
For connecting wires, there are two traditional methods, such as the soldering method and the welding method. However, these methods are ineffective to provide reliable joints between the ultra-fine wires.
With the increasing demand for medical devices involving sensors and other microscopic components, the demand for electromagnetic micro-coils is increasing.
On the other hand, ultra-fine wire connections are necessary to prepare the electromagnetic coils as well as other microscopic components.
Therefore, manufacturers require to obtain the most efficient and precise connecting method for getting rid of the drawbacks of the traditional methods and overcoming multiple environmental and physical factors.
The definitive solution to all these problems is the micro-soldering method or thermal compression bonding method that helps to build effective, reliable, and durable connections between two similar or different ultra-fine wires.
Traditional Methods and the Issues:
The soldering method is about melting a filler metal by using an external heat source to build a connection between the wires. Whereas the welding method is about applying an electric current for melting wires and helping them to get joined. The major issues with these methods are-
- Oxidation on the joints and around the wires makes the wires more durable.
- The damage to the wires, on account of an imprecise heat spread.
- The heat-based soldering methods can cause excessive physical strain on the connections.
Thermal Compression Bonding Technology:
Thermal compression bonding technology, also known as the micro-soldering method, is the most innovative method for the development of ultra-fine wire connections.
Whether it’s about developing a connection between two similar wires or different wires (up to twelve times difference in thickness and also in metal), this method can give you reliable and durable connections.
The connections that you can get using this technology are-
- An efficient connection between tiny thermocouples and miniaturized ultra-fine wires,
- A metal-to-metal connection between an electromagnetic coil and a printed circuit board,
- A reliable connection between a micro-coil and a support system.
Besides offering molecular connections, the thermal compression bonding method or micro-soldering method will also help you to have the most reliable, durable, strain-free, and corrosion-free joints.
This method is also efficient for mass production and therefore, it lessens the total manufacturing costs. Comparing the cost of this method with the traditional method, we can easily conclude that this method is far more economical.
Manufacturers can also implement this process for different customer environments. This method also helps to maintain the high standards of the medical coils as well as fulfills the ultra-strict tolerance requirements.
Above all, there are various application areas for thermal compression bonding technology.
